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At 3M, we apply our expertise directly to your design. Our global technical support team then works with you to find the right solution and seamlessly integrate our products into your processes. Between our testing capabilities, predictive data, access to other 3M technologies and global reach, we offer you outstanding service from concept to manufacturing.
Electronics bonding experts from 3M provide answers to frequently asked questions regarding different substrates, bonding conditions and more.
Achieving proper adhesion of a PSA is done through the following steps:
Adhesives and tapes are polymeric materials and unlike metals, are viscoelastic and their properties are frequency and temperature sensitive. This requires advanced testing to create data that describes what the mechanical response will be under differing loads, temperatures, geometries, etc.
3M is uniquely positioned to characterize these frequency and temperature sensitive materials and provide them in a format compatible with a variety of finite element modeling software. These material models can be used to predict mechanical behavior in a finite element analysis. Conventional mechanical properties, such as Young’s modulus and Poisson’s ratio, even when obtained at relevant rates and temperatures, do not accurately capture adhesives and tapes behavior. Consequently, 3M has developed Material Data Cards (MDCs) which are available for common 3M materials in a ready to use format for numerous commercially available FEA software applications. Currently, we can offer an MDC for any 3M PSA which is compatible with Abaqus, ANSYS MAPDL, ANSYS Workbench, and LS Dyna.
Determining whether to use a liquid adhesive or a tape depends on the dimensional gap you have in your design, your equipment and your design challenges. Tapes are typically used for 2D gaps, when easy application is needed, the thickness of the tape defines gap size, as well as a flexible bond and controlled shapes. Liquid adhesives are typically used when you have a 3D gap filling issue, when an automated process is necessary and when low material costs and high strength adhesion for narrow bond lines below 0.5mm are required.
The 3M product TDS contains information and data that should be considered representative or typical only and should not be used for specification purposes. Final product specifications and testing methods will be outlined in the product Certificate of Analysis (COA) that is shipped with the commercialized product.
The 3M Certificate of Analysis (COA) for a 3M product is established when the product is manufactured and is deemed commercially available from 3M. The COA contains the 3M specifications, test methods and test results for the product performance attributes that the product will be supplied against. Contact your local 3M representative for a product COA.
Surface energy is a physical property of a material that determines whether an adhesive will make intimate contact. On a material with high surface energy, a liquid will spread out or wet the surface; on a material with low surface energy, the liquid will resist flowing and bead up. Good wetting or wet-out means the adhesive makes intimate contact, and is necessary to form an adhesive bond.
Waterproof is defined as impermeable indefinitely while, water resistance is impermeable for a specific pressure and time. Our solutions help make your device water resistant. First, it is important to design your device so that there are minimum or no gaps between parts of the housing. Then, it is necessary to select a bonding solution that is soft enough to fill the gaps created by any unmatched surfaces. If the gap is deeper than the thickness of the tape, a thicker tape should be tested. If the gap is too wide or not uniform then consider testing a liquid adhesive. For liquid adhesives, it is important to have no gaps after the liquid adhesive cures. With clamping and ribs to control bond line thickness, there can be air bubbles along the ribs which can result in poor water resistance performance. In particular, special attention needs to be taken for small bond width.
Reworkability is typically needed when bonding parts that may need to be disassembled, for example to change a component during assembly. Disassembly may be necessary when there is a scratch on a frame and the display needs to be removed without breaking it. Reworkability also enables easier repair of devices. Learn more about reworkability.
Different designs require different bonding solutions. If you are more concerned with helping to keep a screen from breaking and protecting device components, consider choosing a shock absorbing bonding solution such as 3M™ VHB™ Tapes for electronics which is as thin as 150um. If a strong bond is most important, consider a liquid adhesive such as 3M™ Plastic Bonding Adhesive 2665B or 3M™ Scotch-Weld™ PUR Adhesive 2710p. Finally, if an ultra-thin tape at or below 100um is needed, consider testing 3M™ Impact Resistant Adhesive Transfer Tapes 95005 (50um) or 95010 (100um). It is important to note that adhesive thickness helps in drop resistance and helps to prevent the display from cracking.
One way to determine if a tape will bond to a curved shape is to check its anti-lifting test performance. It is also important to make sure the tape thickness is high enough to bridge the gap all along the bond line. Other factors like conformability or compressibility can influence the adhesion performance.
3M combines material science expertise with state-of-the-art testing capabilities to help us better understand our products, compare them and predict how they will work in your designs.
We use a spectrum of test methods in our labs to gather predictive data, from general 180-degree peel, shear/tensile rheology and dynamic shear tests, to methods we’ve developed ourselves. In addition to the standardized data we have on hand, we can test adhesion with your substrates based on your designs. Our goal is to study and understand what kind of forces adhesives will face in real life, so we can help you find the best possible solution for your application. We do the heavy lifting up front so you can focus on building an exceptional device.
Find more information about 3M test methods as they align to various design challenges: impact resistance, water resistance, chemical resistance, curved and foldable surfaces, hard-to-bond surfaces, reworkability, heat resistance.
Find more information on how our bonding solutions can address a wide range of consumer electronics device design applications, including enclosure bonding, display bonding, FPC bonding, camera lens bonding and more.